http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006137842-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5419 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L69-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-02 |
filingDate | 2004-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bd3f70aeaee5ec18eff393ca36eb1d4 |
publicationDate | 2006-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2006137842-A |
titleOfInvention | Resin composition and semiconductor device produced using resin composition |
abstract | PROBLEM TO BE SOLVED: To provide a resin composition having both good adhesive force and good low stress and a semiconductor device having excellent reliability by using the resin composition as a die attach material for a semiconductor or a heat sink attach material. A compound (A) having a structure represented by general formula (1) in the main chain skeleton and having at least two radical-polymerizable carbon-carbon unsaturated bonds, general formula (2) and / or general A resin composition comprising a compound (B) containing formula (3) and a filler (C) as essential components. [Chemical 7] [Chemical 8] [Chemical 9] |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011077459-A |
priorityDate | 2004-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.