http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006137842-A

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filingDate 2004-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bd3f70aeaee5ec18eff393ca36eb1d4
publicationDate 2006-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006137842-A
titleOfInvention Resin composition and semiconductor device produced using resin composition
abstract PROBLEM TO BE SOLVED: To provide a resin composition having both good adhesive force and good low stress and a semiconductor device having excellent reliability by using the resin composition as a die attach material for a semiconductor or a heat sink attach material. A compound (A) having a structure represented by general formula (1) in the main chain skeleton and having at least two radical-polymerizable carbon-carbon unsaturated bonds, general formula (2) and / or general A resin composition comprising a compound (B) containing formula (3) and a filler (C) as essential components. [Chemical 7] [Chemical 8] [Chemical 9]
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011077459-A
priorityDate 2004-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 26.