http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006137791-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate | 2004-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5025a2c4e83e8edabbb7c1c0d9f27b81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a3cbe45049614f1832006acb75837fa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dbf34b24689b29566cf8fce9ca8b17a5 |
| publicationDate | 2006-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006137791-A |
| titleOfInvention | Thermosetting resin composition and cured product thereof |
| abstract | PROBLEM TO BE SOLVED: To provide a cured product exhibiting a low dielectric constant and a low dielectric loss, excellent insulation and excellent thermal shock resistance, and a thermosetting resin composition from which such a cured product can be obtained. SOLUTION: (A) an epoxy resin, (B) a styrene-butadiene copolymer having at least one functional group selected from a carboxyl group, a hydroxyl group and an epoxy group, (C) a curing agent and / or A thermosetting resin composition comprising a curing catalyst. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019518101-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7152017-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007132808-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007056255-A |
| priorityDate | 2004-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 160.