http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006128387-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_366802749d278c1447279515ff2967f3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate | 2004-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_986c3b10f65600fab0bbf070e2af4cfb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9cf95e024e741ae8adb79052e30f5a7 |
| publicationDate | 2006-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006128387-A |
| titleOfInvention | Wafer processing equipment |
| abstract | PROBLEM TO BE SOLVED: To provide a wafer processing apparatus capable of preventing wafer peeling from a base by making the base material suitable. Since a material having a thermal expansion coefficient equivalent to that of a wafer W is used as the substrate 11, the substrate 11 does not expand greatly with respect to the wafer W. Therefore, it is possible to prevent the adhesiveness due to the wax HM from being lowered, and thus it is possible to prevent the wafer W from being peeled off and the position of the substrate 11 from being displaced, thereby preventing a processing failure. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7257199-B2 |
| priorityDate | 2004-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 69.