| abstract |
PROBLEM TO BE SOLVED: To reduce an initial value of connection resistance, suppress an increase in connection resistance under high temperature and high humidity, and high temperature in a conductive adhesive used when connecting an electronic component having a Sn electrode on a circuit board Ensure the connection strength below. A conductive adhesive 30 used when connecting an electronic component 20 having an Sn electrode 21 on a circuit board 10 includes an epoxy resin having a naphthalene skeleton as a main agent and an acid anhydride as a curing agent. And a phenolic resin, imidazole as a curing accelerator, and a conductive filler. The conductive filler 32 is composed of Ag and other metals such as Cu which are lower than Ag and higher than Sn. The acid anhydride and the phenol resin are used in combination, and the epoxy equivalent ratio is 0.8 equivalent, and the breakdown is 95/5 to 5/95. [Selection] Figure 1 |