http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006124432-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D498-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 |
| filingDate | 2004-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72f644399e94172406166da2e88d452a |
| publicationDate | 2006-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006124432-A |
| titleOfInvention | Benzoxazole resin precursor, polybenzoxazole resin, resin film and semiconductor device |
| abstract | An object of the present invention is to provide a benzoxazole resin precursor having a low dielectric constant when a resin film is formed. Another object of the present invention is to provide a resin film excellent in heat resistance and elastic modulus and having a low dielectric constant, and a semiconductor device using the same. The benzoxazole resin precursor of the present invention has a compound having a large free volume in the resin. The polybenzoxazole resin of the present invention is obtained by reacting the benzoxazole resin precursor described above. Moreover, the resin film of this invention is comprised with the resin composition containing the polybenzoxazole resin as described above. A semiconductor device of the present invention has the resin film described above. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8476740-B2 |
| priorityDate | 2004-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 123.