| abstract |
【Task】 Provided is a metal substrate in which the adhesion strength and stability between a metal film and a plastic film are high and the thickness of the metal film can be set thin. [Solution] A plastic film as a substrate is placed in a silane coupling agent coating apparatus, dried at a temperature of 300 ° C., and the vaporized silane coupling agent is sprayed onto the plastic film while maintaining the temperature at 300 ° C. The surface of the plastic film is coated with a silane coupling agent. Further, copper is deposited on the surface of the plastic film coated with the coupling agent by a sputtering method, onto the plastic film with the sputtered copper film. Then, a bright copper coating having a desired film thickness is plated using a plating method. [Selection] Figure 1 |