| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_040b8ace0353c32f51bd886f5c357936 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-00 |
| filingDate |
2004-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba63d5bf5c8b373a39dc83971baf8421
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d2dae1b1d2e93c5ef8badd67257ea5b |
| publicationDate |
2006-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006117959-A |
| titleOfInvention |
Copper powder for electronic materials |
| abstract |
PROBLEM TO BE SOLVED: To provide a copper powder having a high sintering start temperature suitable for a co-fired copper circuit ceramic substrate. SOLUTION: A nitrogen-containing heterocyclic compound or a water-soluble compound having a sintering start temperature of 700 ° C. or higher under an inert atmosphere or a reducing atmosphere and a temperature increase rate of 10 ° C./min or higher. It is a copper powder characterized by being surface-coated with a polymer. [Selected Drawing] FIG. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113210601-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015183255-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016035455-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016191084-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008013837-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011191263-A |
| priorityDate |
2004-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |