| abstract |
PROBLEM TO BE SOLVED: To provide an improved microdevice and a method for manufacturing a microdevice having a microstructure. A microdevice comprises a device microstructure (38) and a vent passage (34) in a wafer (14), the wafer (14) sandwiched between a substrate (10) and a cap (16). ing. The cap (16) and the substrate (10) have recesses (41, 21) around the microstructure (22) to define the cavities. The vent (25) is connected to the vent passage (34) and subsequently to the cavity. The vent hole (25) is used to evacuate and seal the microstructure (38) in the cavity. The getter layer (32) can be used to maintain a vacuum in the cavity. In order to electrically ground the getter layer (32), wiring can be formed in the getter (32) through the vent (25), the vent passage (34) and the cavity. [Selection] Figure 5 |