http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006108504-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03G5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-314
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31
filingDate 2004-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_443c94a74eb140b1bba90adb8169acb9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e44510e9612ba698ea65108d4632798f
publicationDate 2006-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006108504-A
titleOfInvention Reactive sputtering method and reactive sputtering apparatus
abstract To provide a reactive sputtering method and a reactive sputtering apparatus capable of obtaining a high-quality deposited film over the entire surface of the deposited film. As a reactive sputtering method in which a target and a substrate are arranged in a processing container and a reaction product of sputtering particles and a reaction gas supplied into the processing container is deposited on the substrate, the target is applied onto the substrate. A partition plate is disposed in a space in which the sputtered particles fly so as to substantially divide the formation film formation surface of the substrate into a plurality of regions without coming into contact with the formation film formation surface of the substrate. A reaction gas having a flow rate corresponding to the deposition rate of the sputtering particles is caused by the partition plate from a reaction gas supply nozzle disposed toward each of the regions partitioned by the partition plate in each space surrounded by the plate. It supplies to the formation film formation surface of the said base | substrate installed in each of the divided area | region. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008171874-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111378945-A
priorityDate 2004-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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