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publicationDate 2006-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006105933-A
titleOfInvention Membrane with bump, manufacturing method thereof, and wafer inspection method
abstract PROBLEM TO BE SOLVED: To provide a membrane with a bump which suppresses variation in shape as much as possible and can cope with a fine electric circuit with a bump. SOLUTION: A plurality of bumps 32 integrally formed with a probe 31 whose diameter gradually decreases from one end to the other end and a large-diameter electrode 30 whose diameter is larger than the diameter of the one end of the probe 31; And a plurality of bumps 32, each of which is insulatively held at a predetermined position. The probe 31 is disposed through the insulating base 12 in the thickness direction, and the large-diameter electrode 30 is insulated from the insulating base 12. A membrane with bumps, wherein a metal film 11 is disposed between the substrate 12 and the substrate 12. [Selection] Figure 1
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