http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006098146-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-06
filingDate 2004-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e242b354d43ebf485c6a1b0a543430c0
publicationDate 2006-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006098146-A
titleOfInvention Wiring board and semiconductor element inspection apparatus using the same
abstract PROBLEM TO BE SOLVED: To provide a large-sized wiring board capable of performing electrical inspection in a lump capable of accurately aligning a plurality of semiconductor element circuits formed on a semiconductor wafer. An upper terminal 2 is formed on an upper surface of an insulating substrate 1 and a lower terminal 3 electrically connected to the upper terminal 2 is formed on a lower surface of the insulating substrate 1. A plurality of through holes 4 are formed in the part, and a light emitting element mounting part 5 is provided around the opening of the through hole 4 on the lower surface of the insulating substrate 1. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021182084-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106645817-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106645817-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020255190-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020255190-A1
priorityDate 2004-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID159990
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452055648

Total number of triples: 19.