abstract |
A heat conductive graphite sheet used as a heat dissipation material is composed mainly of carbon and has electrical conductivity, but has a resistance value of several ohms. When used for heat dissipation of semiconductor devices, there is a problem that the high frequency characteristics of the equipment cannot be satisfied. A highly conductive thermal orientation graphite sheet with high thermal conductivity is provided with a slit penetrating the thermal conductive graphite sheet, and a conductor is provided on the entire surface of the thermal conductive graphite sheet including the inner surface of the slit. By having a conductive heat conductive sheet with a configuration in which it is arranged, it has high thermal conductivity characteristics and low electrical resistance characteristics, and has the effect of satisfying heat countermeasures and high-frequency characteristics of electronic devices and high-speed communication devices . [Selection] Figure 1 |