http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006093389-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L31-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K63-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate | 2004-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4cdf57dc3b3dda7f4df48247fec4d8c3 |
| publicationDate | 2006-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006093389-A |
| titleOfInvention | Molding method of sealing resin |
| abstract | To provide a molding method for preventing a short circuit accident of a semiconductor due to mixing of metal fine particles derived from a sealing resin. A sealing resin molding method characterized in that when a sealing resin is molded using a mold, a magnetic field is imposed on a mold flow path in which the resin flows, and preferably a magnetic field is imposed. Means for inserting a magnetic body into the mold or attaching the magnetic body to the outside of the mold, and the sealing resin contains an epoxy resin and silica and is used for a semiconductor package Molding method. |
| priorityDate | 2004-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261 |
Total number of triples: 15.