| abstract |
An electroless palladium-silver alloy plating solution capable of forming a palladium-silver alloy film having excellent performance is provided. [Solution] (I) a water-soluble palladium compound, (Ii) a water-soluble silver compound, (Iii) at least one component selected from the group consisting of ammonia, monomethylamine, monoethylamine, dimethylamine, diethylamine and monoethanolamine; (Iv) General formula: [Chemical 1] (Wherein n is an integer of 1 to 5, and R is a hydrogen atom or —CH 2 —CH 2 —NH 2 ), (V) a water-soluble aldehyde compound, and (vi) a water-soluble compound containing a transition element of the fourth period of the periodic table, An electroless palladium-silver alloy plating solution comprising an aqueous solution containing [Selection figure] None |