http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006070324-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34
filingDate 2004-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c267c04401fb2a67faaecbbdd899db98
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1786397a4d5f34357248cd6c626f9991
publicationDate 2006-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006070324-A
titleOfInvention Sputtering target and sputtering method
abstract PROBLEM TO BE SOLVED: To provide a sputtering target and a sputtering method capable of forming a metal fluoride film having no light absorption at a constant deposition rate. A target electrode used for sputtering has a target 1 fixed on a backing plate 3 via a quartz plate 2. The backing plate 3 is provided with a cooling pipe so that the lower surface of the target 1 is cooled. The target 1 is made of MgF 2 and has a density of 90% or more with respect to the bulk density of MgF 2 . [Selection] Figure 1
priorityDate 2004-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 22.