http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006063108-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-103 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L91-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2004-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a39ef7424ff721b11dda09a52a5f8a1b |
| publicationDate | 2006-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006063108-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating a semiconductor which has excellent mold release properties and continuous moldability and has excellent solder resistance. SOLUTION: (A) epoxy resin, (B) phenol resin, (C) curing accelerator, (D) inorganic filler, (E) oxidized microcrystalline wax, (F) silane coupling agent and (G) aroma A compound in which a hydroxyl group is bonded to each of two or more adjacent carbon atoms constituting a ring is an essential component, and at least one of the (A) epoxy resin and the (B) phenol resin has a biphenylene skeleton in the main chain. A resin having a novolac structure having 0.01 to 1% by weight of the component (E) in the total epoxy resin composition and 0.01 to 1% by weight of the component (G) in the total epoxy resin composition. The epoxy resin composition for semiconductor sealing characterized by including%. |
| priorityDate | 2004-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 54.