http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006060047-A

Outgoing Links

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filingDate 2004-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ada26b8038387ccde4ce627d1df9cb8
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publicationDate 2006-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006060047-A
titleOfInvention Wiring board and manufacturing method thereof
abstract PROBLEM TO BE SOLVED: To improve the productivity by reducing the number of pressing processes necessary for the production of a wiring board, improve the productivity, and peel off the metal layer for forming the wiring film on the interlayer insulating film or the peeling of the wiring film. Increase strength. An embedding metal layer is laminated by pressing on a surface of a wiring film forming metal plate having a metal bump for inter-layer connection formed on one surface via an inter-layer insulating film. The surface portions of the metal layer 12 and the interlayer insulating film 10 are polished until the top surfaces 4a of the metal bumps 4 are exposed, so that a buried metal layer 12a is formed on the surface of the interlayer insulating film 10. A wiring film forming metal layer 16 having at least a portion connected to the top surface 12a of the metal bump 12 is formed on the surface of the insulating film 10c by plating. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016004851-A
priorityDate 2004-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 19.