| abstract |
PROBLEM TO BE SOLVED: To provide a resin composition, a substrate material, a sheet, a laminate, a resin-coated copper foil, a copper-clad laminate having excellent mechanical properties, dimensional stability, heat resistance, flame retardancy, etc., particularly excellent high-temperature properties, TAB tape, printed circuit board, prepreg and adhesive sheet are provided. A resin composition containing 100 parts by weight of a thermoplastic resin (including at least a thermoplastic polyimide resin) and 0.1 to 65 parts by weight of an inorganic compound, which is 10 times higher than the glass transition temperature of the resin composition. A resin composition having an average linear expansion coefficient (α2) of 1.0 × 10 −3 [° C. −1 ] or less from a temperature higher by 50 ° C. to a temperature higher by 50 ° C. than the glass transition temperature of the resin composition. [Selection figure] None |