| abstract |
PROBLEM TO BE SOLVED: To provide a stainless steel contact material which shows a low contact resistance even after being used for a long time in a humid atmosphere. SOLUTION: The base material is stainless steel 1 containing Cu: 1.0% by mass or more, Cr: 9% by mass or more, and Cu-rich phase 2 dispersed in a matrix at a ratio of 0.2% by volume or more. : 0.05 to 0.7 μm Ni plating layer 3 is a contact material formed on the substrate surface. Instead of the Cu-rich phase, even if a Cu enriched layer having a Cu / (Si + Mn) mass ratio of 0.5 or more is formed on the extreme surface layer, it becomes a contact material that maintains low contact resistance. [Selection] Figure 1 |