http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006052409-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83101 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-06 |
| filingDate | 2005-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6572637023228686de656bac396bda38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d19d3b15a3e9b71104610ecec54ab30a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92a4c79fd5064274316dd0b47f9697b9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b50a91c9eeddb59455ae0a4466ebec98 |
| publicationDate | 2006-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006052409-A |
| titleOfInvention | Adhesive film, semiconductor package or semiconductor device using the same, and method for manufacturing semiconductor package or semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an adhesive film having a flux function and improving workability at the time of bonding, and a semiconductor package and a semiconductor device using the same. In addition, a semiconductor package and a method for manufacturing a semiconductor device, which are easy to manufacture and have a low yield, are provided. An adhesive film of the present invention is an adhesive film used for mounting a semiconductor element or a semiconductor device, and includes a first resin having at least one phenolic hydroxyl group, a second resin, And a third resin having a weight average molecular weight lower than that of the second resin. The semiconductor package of the present invention is characterized in that a semiconductor element and an interposer are mounted with the above-mentioned adhesive film. The semiconductor device of the present invention is characterized in that a semiconductor package and a printed wiring board are mounted with the above-described adhesive film. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012241162-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101243603-B1 |
| priorityDate | 2005-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 46.