| abstract |
PROBLEM TO BE SOLVED: To increase the use form and demand of an IC chip formed from a silicon wafer, and further cost reduction is required. Therefore, an object of the present invention is to provide an IC chip structure and process that can be produced at a lower cost. In the present invention, a metal film and a reaction product including the metal film are used for a release layer. A metal film or a reaction product containing a metal is preferable because it has a high etching rate. Furthermore, in addition to a chemical means for etching a metal film or a reaction product containing a metal, a physical means can be used. The release layer can be removed over time. [Selection] Figure 2 |