| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate |
2004-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8fd3fea317f7429da9913ccd22077d5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d1b43557e0b6e627ef734720540fb2e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df15d0893e8cca2782510403e65a0cb9 |
| publicationDate |
2006-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006049507-A |
| titleOfInvention |
Wafer processing tape and semiconductor device manufacturing method using the same |
| abstract |
【Task】 The present invention provides a wafer processing tape capable of suppressing chipping when wafers are bonded and diced. [Solution] Wafer processing tape in which an intermediate resin layer and an adhesive layer are laminated in this order on a base film, and tan δ determined by dynamic viscoelasticity measurement of the intermediate resin layer applied and formed on the base film The peak (glass transition point) is −20 ° C. or higher, which is higher than the glass transition point of the pressure-sensitive adhesive layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7158567-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011211130-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008163276-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9165815-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012530376-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008013692-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008081725-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020203287-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020203287-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008063492-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011211129-A |
| priorityDate |
2004-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |