| abstract |
PROBLEM TO BE SOLVED: To improve the reliability of flip chip connection in assembling a semiconductor device. A dummy terminal 5d is provided at an end portion of a row of a plurality of flip chip terminals 5e in a package substrate 5, whereby a flow of flux and solder is suppressed by the dummy terminals 5d and a plurality of flip chip terminals are provided. The solder layer 4 can be formed on the terminal 5e, so that the solder is not attached to the wire connection terminal 5f provided in the vicinity of the flip chip terminal 5e. A sufficient thickness of the solder layer 4 to be formed can be ensured, and as a result, the reliability of flip chip connection can be improved. [Selection] Figure 8 |