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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D7-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1368
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D1-26
filingDate 2004-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a09c084c25cdcc36b38a6944343f53d
publicationDate 2006-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006043623-A
titleOfInvention Pattern forming method, device manufacturing method, device, active matrix substrate manufacturing method, electro-optical device, and electronic apparatus
abstract PROBLEM TO BE SOLVED: To provide a thin film forming method and the like capable of satisfactorily adhering nickel particles by forming the nickel thin film by an ink jet method while dispersing the nickel particles while preventing sedimentation. A functional liquid 33a is disposed on a substrate P using a droplet discharge method to form a predetermined pattern 33, and a first functional liquid 33a in which conductive fine particles are dispersed in a dispersion medium is provided. The step of disposing on the substrate P, the step of disposing the second functional liquid 34a in which nickel fine particles are dispersed in the dispersion medium on the first functional liquid 33a, and improving the adhesion of the nickel fine particles on the second functional liquid 34a. And a step of disposing a coupling agent 35 to be selected.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007268422-A
priorityDate 2004-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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