http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006037048-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C217-90 |
| filingDate | 2004-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4ce5677e88d2890ecca92a97aee3a5d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d983894527b61ee5ce8b1b3026cd67ba |
| publicationDate | 2006-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006037048-A |
| titleOfInvention | Aminophenol compound, thermosetting resin and process for producing the same |
| abstract | PROBLEM TO BE SOLVED: To provide an aminophenol compound that can be suitably used as a raw material for a thermosetting resin having excellent heat resistance, and excellent heat resistance without deteriorating mechanical strength, moisture resistance, electrical characteristics and other characteristics. A thermosetting resin exhibiting properties and a method for producing the same are provided. An aminophenol compound having an aromatic group having a group containing an aminophenol structure in the main chain. In the aminophenol compound, the aminophenol structure is an o-aminohydroxyphenoxy structure. Moreover, it is based on the thermosetting resin which has the aromatic group which has a substituent containing the amide phenol structure which has an organic group on carbon of an amide bond in a principal chain. In the thermosetting resin, the amidophenol structure is an o-amidohydroxyphenoxy structure. |
| priorityDate | 2004-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 106.