| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3477
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| filingDate |
2004-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d70ab8ad20ce2e3455ea786b12c6e3f6 |
| publicationDate |
2006-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006036940-A |
| titleOfInvention |
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation for a new marking method enabling easy and clear identification. A semiconductor sealing resin composition that emits fluorescence upon irradiation with black light, and contains a fluorescent agent together with at least an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator. Let it be the epoxy resin composition for sealing. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007260073-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101898571-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008035897-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008186886-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20230044982-A |
| priorityDate |
2004-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |