| abstract |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition capable of obtaining a multilayer circuit board having excellent high frequency characteristics, adhesion, flatness and flame retardancy and excellent balance between these characteristics. Furthermore, an electrical insulating film, a laminate, and a multilayer circuit board are provided using this thermosetting resin composition. An electrically insulating carboxyl group-containing polymer (A), a polyvalent epoxy compound (B) having no halogen atom, a halogenated polyvalent epoxy compound (C), and antimony trioxide (D) are contained. And the total blending amount of the polyvalent epoxy compound (B) having no halogen atom and the halogenated polyvalent epoxy compound (C) is 100 parts by weight of the electrically insulating carboxyl group-containing polymer (A). A thermosetting resin composition characterized by being 10 to 70 parts by weight and having a blended weight ratio (B) / (C) of 5/95 to 35/65. Electrical insulating film, laminate and multilayer circuit board using the same. |