| abstract |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of controlling a mechanical displacement caused by a bonding process, a CMP process, a thermal stress or the like and a displacement of a via due to a deformation of a wafer, and a manufacturing method thereof. SOLUTION: A first wiring 22, a low dielectric constant insulating film 310 disposed on the first wiring 22, and embedded in the low dielectric constant insulating film 310 so as to be connected to the first wiring 22, The first length Lx measured in the longitudinal direction of the first wiring 22, the second length Ly measured in the direction orthogonal to the first wiring 22 on the plane where the first wiring 22 is arranged, and the first wiring 22 are arranged. Arranged on the plurality of first flat vias 31a and 31b having a ratio of at least one of the first and second lengths Lx and Ly to the height H perpendicular to the plane of 1 or more, and the low dielectric constant insulating film 310 And a second wiring 32 connected to each of the plurality of first flat vias 31a and 31b. [Selection] Figure 1 |