| abstract |
PROBLEM TO BE SOLVED: To provide a curable resin composition that has storage stability at room temperature, has immediate curing properties, and exhibits adhesive reliability after curing, and an adhesive epoxy resin sheet using the curable resin composition, In addition, a circuit board assembly obtained by using these is provided. An epoxy resin (preferably having a polycyclic hydrocarbon skeleton in the main chain), a solid polymer having a functional group that reacts with an epoxy group (preferably an acrylic polymer having an epoxy equivalent of 100 to 1000), A curable resin composition containing a curing agent for epoxy resin, wherein the curing agent for epoxy resin has a melting point of 110 ° C. or less, particularly preferably 1-isopropyl-4-methylbicyclo- [2.2.2] -Oct-5-ene-2,3-dicarboxylic anhydride), a curable resin composition, an adhesive epoxy resin sheet, and a circuit board assembly. [Selection figure] None |