http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006015662-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate | 2004-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26bd602fca21e25af50ddd1150366d18 |
| publicationDate | 2006-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006015662-A |
| titleOfInvention | Film with metal foil |
| abstract | PROBLEM TO BE SOLVED: To prevent a fine circuit pattern from dropping off when a circuit pattern is formed by etching or the like, and at the time of transfer, a metal foil and an adhesive layer without any special process. Providing a film with metal foil suitable for manufacturing a multilayer wiring board that can reduce the adhesive strength between the substrate and the circuit pattern, and can prevent circuit pattern transfer failure, displacement, and adhesive residue. To do. A metal foil-attached film in which a metal foil is attached to one surface of a substrate via an adhesive layer, wherein the adhesive layer contains a chelating agent. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114400145-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114400145-A |
| priorityDate | 2004-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.