http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006013699-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24461d63db51630fb1930da1e2710b92
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H3-02
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filingDate 2004-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7819630aa3576ff5aff8dc778d0f1515
publicationDate 2006-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006013699-A
titleOfInvention Electronic component package and method of manufacturing electronic component package
abstract A mounting area for mounting electronic components on a surface of a base is expanded without hindering downsizing. A package includes a base and a lid. The lid | cover 32 consists of a flat plate body which a plate-shaped body bends and consists of L-shaped two surfaces. A sealing film 33 made of a metal is formed on the lower surface side of the lid 32. The base 31 includes a bottom part 34 of a rectangular parallelepiped and a wall part 35 provided along three sides of the surface 341 of the bottom part 34, and the side part 342 is opened without forming the wall part 35. On the surface 341 of the base 31, a mounting region 36 for mounting the crystal vibrating piece 2 is formed. A bonding region 37 for bonding to the lid 32 is formed on the wall surface 351 of the wall portion 35 of the base 31 and one side surface 311 of the bottom 34. These joining regions 37 are formed by a metal film 38 made of a metal material. [Selection] Figure 2
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11688994-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11539182-B2
priorityDate 2004-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449159271

Total number of triples: 21.