http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006013223-A

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filingDate 2004-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e643c5365eefa550524263e9b2f723b4
publicationDate 2006-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006013223-A
titleOfInvention Wiring structure
abstract PROBLEM TO BE SOLVED: To provide a wiring structure capable of easily changing a wiring by using an ink jet method when a wiring change such as a wiring design error is performed on a circuit board including an electronic element. A first conductive liquid material 11a is ejected and formed by a droplet ejection device 1, and then a first conductive wiring 23 as a high-quality conductive film is obtained after heat and / or light treatment. A wiring connection portion 23a as a part of the first conductive wiring 23 is electrically connected to the conductor pattern 21b as a part of the wiring of the circuit board 10A. Further, a part of the conductor pattern 21 j as another wiring of the circuit board 10 </ b> A is electrically connected to a wiring connection part 23 b as another part of the first conductive wiring 23. [Selection] Figure 1
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