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filingDate 2004-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2006-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006008956-A
titleOfInvention Semiconductor sealing resin composition and semiconductor device using the same
abstract Disclosed is a resin composition for encapsulating a semiconductor, which can improve resin filling properties when molding, encapsulating, or the like of a semiconductor element. A semiconductor sealing resin composition containing the following components (A) to (D) and having a hot hardness (Shore D hardness) at a molding temperature of 70 or more and 80 or less. (A) Thermosetting resin. (B) Curing agent. (C) A curing accelerator. (D) Inorganic filler. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008231242-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011216769-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7290001-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11664407-B2
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