abstract |
Disclosed is a resin composition for encapsulating a semiconductor, which can improve resin filling properties when molding, encapsulating, or the like of a semiconductor element. A semiconductor sealing resin composition containing the following components (A) to (D) and having a hot hardness (Shore D hardness) at a molding temperature of 70 or more and 80 or less. (A) Thermosetting resin. (B) Curing agent. (C) A curing accelerator. (D) Inorganic filler. [Selection figure] None |