http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006001997-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-521
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filingDate 2004-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bb35ccf283eba5558025ab1599e2f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97bdea672a7c8698f6aa63874e28ba46
publicationDate 2006-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006001997-A
titleOfInvention Flame retardant resin composition, prepreg, laminate for printed wiring board and printed wiring board
abstract PROBLEM TO BE SOLVED: To provide a flame retardant resin composition prepreg, a laminated board for printed wiring board, which does not contain a halogen-based flame retardant, satisfies flame retardant standards, and has good characteristics such as drill workability, moisture and heat resistance, and Tg. To provide a printed wiring board. [Solution] (A) a compound having a dihydrobenzoxazine ring in the molecule, (b) a phosphorus compound having a structure represented by the following formula (1) And (c) a resin composed of a compound having reactivity with a phenolic hydroxyl group formed by ring opening of a dihydrobenzoxazine ring and a dihydrobenzoxazine ring as an essential component, and all materials used have a halogen content of 0. A flame retardant resin composition, a prepreg, a laminate for a printed wiring board, and a printed wiring board, each having a content of 1% by weight or less. [Selection figure] None
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