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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00
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filingDate 2003-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2005-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005531420-A
titleOfInvention Reducing irregularities in contacting micro structures
abstract A device is disclosed that includes a moveable microstructure (802) configured to contact a substrate (801). The substrate (801) has a metal-insulator-metal configuration, and the upper metal layer and the insulator are patterned so that the contact region of the substrate (801) is provided in the lower metal layer. The micro structure (802) has a metal underlayer to provide a ribbon contact area (809). In use, a bias voltage is applied between the micro structure (802) and the upper metal layer (825), thereby contacting the micro structure and the substrate through the contact region. While in contact, the contact region is maintained at a potential substantially less than the applied bias voltage, thereby reducing the formation of relief structures in an optical MEM device configured to modulate light. Is done.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018074084-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018074084-A1
priorityDate 2002-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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