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filingDate 2002-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2005-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005520044-A
titleOfInvention Flat metal electrical treatment
abstract PROBLEM TO BE SOLVED: To provide a method for forming a flat conductive surface on a wafer. In one aspect, the present invention uses a non-contact process by electrochemical deposition followed by a contact process by electrochemical mechanical deposition. In other embodiments, the non-contact process by electrochemical deposition uses the solution that was in the non-contact process, and the contact process by electrochemical mechanical deposition uses the solution that was in the contact process.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8679576-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8383956-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8128790-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012231152-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8197659-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007097335-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007224347-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7897027-B2
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priorityDate 2001-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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