http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005519480-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24562 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24331 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02118 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03C5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-00 |
| filingDate | 2003-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2005-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005519480-A |
| titleOfInvention | Lithographic pattern reduction method and member |
| abstract | A novel method of applying a thin, uniform, conformal, organic polymerizable film in a lithographic pattern substrate by a wide variety of deposition processes. The method of the present invention equally reduces the gaps in the lithographic pattern, thereby creating smaller dimensions. The amount of pattern reduction can be adjusted by adjusting the deposition rate, giving the desired final structure dimensions. A wide variety of organic films are used as materials for these films. Applicable device-level examples include gate layer fabrication, ion implantation of active device layers and independent metal layers, dielectric patterning, damascene, dual damascene fabricated connection processes, back-end packaging layers, and electro Includes devices that require multiple layers deposited by deposition, CVD or sputtering. The method of the present invention is useful for providing highly conformal coatings on high surface area substrates having an ultra-submicron shape (ie, 0.15 μm or less). The method of the present invention is environmentally friendly and relatively inexpensive compared to other options. |
| priorityDate | 2002-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 97.