| abstract |
A silicone resin is provided, the resin comprising 5 to 50 mol% (PhSiO (3-x) / 2 (OH) x ) units and 50 to 95 mol% (HSiO (3-x) / 2 (OH) x ) units, where Ph is a phenyl group and x has a value of 0, 1, or 2 and the cured silicone resin has a critical surface free energy of 30 dynes / cm or more. These resins are useful as etch stop layers for organic dielectric materials having a critical surface free energy of 40 dynes / cm or higher. |