| abstract |
A method of manufacturing an ultrasonic transducer assembly is provided. The method generally includes the steps of creating a multilayer rigid or flexible printed circuit board having an upper surface and a lower surface, creating a patterned conductive layer on each of the upper and lower surfaces, Creating at least one patterned backplate electrode, or a portion of a discrete component that is subsequently attached to the substrate, and creating at least one conductive through-hole via integrated with the substrate; Configured to roughen at least a portion of each of the at least one backplate to introduce gas pockets into the portion of the surface of the backplate, and to form a capacitive structure with the at least one backplate An insulating or dielectric single-layer or multi-layer thin film having an integrated conductive surface is formed on a substrate. And a step of adhering the minute. |