| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H2050-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H2036-0093
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H50-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0077
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H36-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H1-0036 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K31-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H51-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H36-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H50-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H49-00 |
| filingDate |
2002-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2005-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005503659-A |
| titleOfInvention |
Micro Magnetic Latch Relay Package and Packaging Method |
| abstract |
A method of forming a hermetically sealed MEMS package (10) includes: a GaAs support substrate (12) having at least one contact (17, 18) for a MEMS device (10) on a surface of the support substrate (12). And forming a cantilever (16) on the surface of the support substrate (12) in one direction at a position to be electrically coupled with the contacts (17, 18). A metal sealing ring (20A) surrounds the contact and cantilever (16) and is secured on the surface of the support substrate (12). The cavity is etched in the silicon chip (12) to form a cap member (22). A metal sealing ring (20A) is secured to the cap member (22) around the cavity. The package (10) is hermetically sealed by reflowing the solder alloy positioned between the two sealing rings (20A) in an inert environment where no flux is used. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4702325-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008305677-A |
| priorityDate |
2001-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |