http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005354043-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d5d04736b0b882a4f5a1e0e0e4cd8cbb |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0292 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0425 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0485 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3485 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate | 2005-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_329ed8caaa603682286660a4f4c44a83 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cff3957f06de3fab5707ae7e10d52cb |
| publicationDate | 2005-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005354043-A |
| titleOfInvention | Electronic circuit board manufacturing method |
| abstract | An electronic circuit board capable of realizing a finer circuit pattern in a method of manufacturing an electronic circuit board in which solder powder is attached to an adhesive portion and then the printed wiring board is heated to dissolve the solder to form a solder circuit. Manufacturing method, a highly reliable electronic circuit board having a fine circuit pattern, and a circuit board mounted with electronic components capable of realizing high reliability and high mounting density. A method for attaching solder powder to an electronic circuit board, in which adhesiveness is imparted to an exposed metal surface on a substrate and solder powder is attached to the adhesive portion in a liquid, and solder powder is applied to the adhesive portion. A method for manufacturing an electronic circuit board in which a substrate is immersed in a liquid having a concentration of 0.5 to 50 in an apparent volume% and then heated to melt the solder to form a solder circuit An electronic circuit board manufactured using the method for manufacturing the electronic circuit board, and an electronic circuit board on which an electronic component manufactured using the electronic circuit board is mounted. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008041803-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008041867-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008016128-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8123111-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8109432-B2 |
| priorityDate | 2004-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 53.