http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005353781-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9b5d58119b48e6e6ae449afc394066f3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate | 2004-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7eb1c7c390a8301ec1124519975d9520 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46002328eb89433a84cb5b6399c22488 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c8245570696dbcfb17ae9348295fac42 |
| publicationDate | 2005-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005353781-A |
| titleOfInvention | Conductive paste composition for multilayer wiring board |
| abstract | The present invention relates to a thermosetting conductive paste composition for use in a multilayer wiring board, which is used for conductor wiring in an inner layer portion, an outer layer portion, and a via hole portion in a batch multilayer wiring board using a crystalline thermoplastic resin as an insulating substrate. Even in this case, a conductive paste composition capable of ensuring sufficient substrate reliability with respect to moisture absorption reflow heat resistance, resistance value, and the like is provided. A multilayer wiring board obtained by laminating a wiring board having a conductive paste composition on the surface and via hole portion of an insulating base material obtained from a crystalline thermoplastic resin composition by thermal fusion. The conductive paste composition used for the above-described process comprises a conductive powder and an addition-type thermosetting imide monomer, and the curing peak temperature of the polyimide derived from the addition-type thermosetting imide monomer is the above crystalline heat. A conductive paste composition for a multilayer wiring board, which has a glass transition temperature (Tg) of the plastic resin composition minus 15 ° C. or higher and lower than a crystallization peak temperature (Tc). [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015523707-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010123830-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008243391-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017179532-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008010858-A |
| priorityDate | 2004-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.