| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0959
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24926
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4673
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B17-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4688 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B17-04 |
| filingDate |
2004-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad7191e8e6182402667eac10a6e0129c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ad4007884bb15067f9b4001b6055d84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81a2ab3b1a5c39ea3f3efc5268647296 |
| publicationDate |
2005-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005340686-A |
| titleOfInvention |
Multilayer substrate, method for manufacturing the same, and electronic apparatus having the multilayer substrate |
| abstract |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated substrate which gives a yield improvement and / or desired physical properties (that is, thermal expansion coefficient or longitudinal elastic modulus), a laminated substrate, and an electronic apparatus having such a laminated substrate. . A method of manufacturing a multilayer substrate having a core layer that functions as a printed circuit board, and a build-up layer that has an insulating portion and a wiring portion and is electrically connected to the core layer. In order to make the coefficient of thermal expansion of a predetermined value, a manufacturing method is provided, comprising the steps of setting the coefficient of thermal expansion of each layer, the thickness of each layer, and the longitudinal elastic modulus of each layer. [Selection] Figure 2 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010183312-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010050116-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8988892-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010090070-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8168471-B2 |
| priorityDate |
2004-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |