http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005337944-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b8ca6ee864e0448264aa0f90630b89c3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 2004-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c1eda5a6fe3af76ed61464d24cd5d6f |
| publicationDate | 2005-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005337944-A |
| titleOfInvention | Device handler |
| abstract | PROBLEM TO BE SOLVED: To provide a device handler capable of appropriately managing the temperature of a device. A device handler includes a device guide in which a contact portion that contacts a lead terminal of an IC device is formed. An electric insulating film is formed on the surface of the contact portion, and heat from the heater can be efficiently transmitted to the IC device through the contact portion and the metal lead wire. For this reason, the heat taken away from the IC device at the time of inspection at high temperature can be effectively compensated. The device guide may be entirely or partially formed of metal, or may be entirely or partially formed of resin. [Selection] Figure 1 |
| priorityDate | 2004-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID297 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559581 |
Total number of triples: 12.