| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06 |
| filingDate |
2004-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7e933bb4657cb10fe4111b816e229d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06fa786214dc7c4520b67a8be765723c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_096e79fe344855559ec13ac6997d4bbe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f181dc31298ec8d21d45cb27212c798b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3a3c8b972120fefdae22445236dff1f |
| publicationDate |
2005-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005325210-A |
| titleOfInvention |
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| abstract |
For example, an epoxy resin composition for semiconductor encapsulation that is excellent in filling property and void resistance in a flip chip package and can suppress the occurrence of warpage is provided. An epoxy resin composition for semiconductor encapsulation containing an inorganic filler together with the following components (A) to (C). And the said inorganic filler consists of the following (D) component. (A) An epoxy resin represented by the following general formula (1). [Chemical 1] (B) Phenolic resin. (C) A curing accelerator. (D) Spherical inorganic filler having a particle size of 45 μm or more and an average particle size of 15 μm or less and surface-treated with a silane coupling agent having an acryl group or a methacryl group . [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012149266-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018518563-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012188555-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012149111-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10294341-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012041510-A |
| priorityDate |
2004-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |