| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06 |
| filingDate |
2004-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_096e79fe344855559ec13ac6997d4bbe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f181dc31298ec8d21d45cb27212c798b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06fa786214dc7c4520b67a8be765723c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3a3c8b972120fefdae22445236dff1f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7e933bb4657cb10fe4111b816e229d0 |
| publicationDate |
2005-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005325209-A |
| titleOfInvention |
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| abstract |
The present invention provides an epoxy resin composition for semiconductor encapsulation having excellent filling properties and resistance to entrainment voids. An epoxy resin composition for semiconductor encapsulation containing an inorganic filler together with the following components (A) to (C). And the said inorganic filler consists of the following (D) component. (A) Epoxy resin. (B) Phenolic resin. (C) A curing accelerator. (D) The inorganic filler which contains the following (d1) component in 5-50 weight% of the whole inorganic filler. (D1) A spherical inorganic filler having an average particle size of 0.5 to 3 μm, which is surface-treated with a silane coupling agent having an acryl group or a methacryl group. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012149111-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7969027-B2 |
| priorityDate |
2004-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |