| abstract |
Provided is a semiconductor device monolithically mounted with different types of elements composed of fine structures such as MEMS elements. A semiconductor substrate including an integrated circuit, a resonator disposed on the semiconductor substrate, an inductor element, a variable capacitance element, a switch element, and a semiconductor substrate are provided so as to cover them. The resonator 112, the variable capacitance element 114, and the switch element 115 are a micromachine (passive element) including a movable movable beam supported on a support portion. [Selection] Figure 1 |