Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
filingDate |
2004-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0edc5d1e8dab7487a647e8bbf9920ba2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a418d397d651201f83f4400501aefda http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_812826c632c0281daebe36eca28ab878 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4e696b2f776b37517b71893e8ae1b03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a93695d1ddd1dcca0566603716e0c5d |
publicationDate |
2005-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2005319633-A |
titleOfInvention |
Method for producing flexible copper-clad laminate |
abstract |
PROBLEM TO BE SOLVED: To provide a method for producing a flexible copper clad laminate which can be used for electronic parts such as a printed board and a flexible printed board which are excellent in peel strength and heat resistance and can be easily handled. SOLUTION: A polyimide precursor resin solution is applied to a copper foil having a surface roughness Ra = 0.08 to 0.60, and the residual solvent of the applied polyimide precursor resin solution is 10% by mass. Production of a flexible copper-clad laminate, wherein the polyimide-based precursor resin is imidized after being dried to 80% by mass or less and pasting a polyimide film on the polyimide-based precursor resin solution Method. [Selection figure] None |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008091431-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008143101-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007184405-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007059892-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4692758-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008143032-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007223205-A |
priorityDate |
2004-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |