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filingDate 2004-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04bb4340db1eca700fb6687862828d4e
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publicationDate 2005-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005307321-A
titleOfInvention Thin film forming apparatus and thin film forming method
abstract PROBLEM TO BE SOLVED: To provide a thin film forming apparatus and a thin film forming method capable of obtaining a dense and uniform thin film and having a high film forming speed. A method of forming a thin film, comprising: a voltage applying means for applying a voltage; a discharge space formed by the voltage applying means; and a gas introducing means for allowing a discharge gas and a reactive gas to flow into the discharge space. The discharge gas is supplied from behind the reactive gas to the substrate on which film formation is performed, and the reactive gas is brought into contact with the substrate to form a film. The reactive gas supplied to the discharge space has a flow velocity V (m / sec), 0.5 ≦ V ≦ 10 A method of forming a thin film, wherein the thin film is configured to move on the surface of the substrate at a speed of 5 mm. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011179104-A
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