| abstract |
PROBLEM TO BE SOLVED: To provide a copper-clad laminate and a printed circuit board having high moisture and heat resistance even when a thin fiber substrate is used, and a prepreg for obtaining the same. SOLUTION: A fiber base material and a resin composition impregnated therein are provided. The resin composition includes (a) a polyamideimide resin, (b) a thermosetting resin, and (c) a phenol-based antioxidant. A prepreg 100 containing an agent or a sulfur-based antioxidant. [Selection] Figure 1 |